JPH0525670B2 - - Google Patents

Info

Publication number
JPH0525670B2
JPH0525670B2 JP60142680A JP14268085A JPH0525670B2 JP H0525670 B2 JPH0525670 B2 JP H0525670B2 JP 60142680 A JP60142680 A JP 60142680A JP 14268085 A JP14268085 A JP 14268085A JP H0525670 B2 JPH0525670 B2 JP H0525670B2
Authority
JP
Japan
Prior art keywords
polyimide
layer
heat
carrier material
sealable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60142680A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6119352A (ja
Inventor
Efu Kundeingaa Erunsuto
Kurimeshu Eeritsuhi
Gee Tsuengeru Hansu
Dee Rashaa Jefuerii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Akzo NV
Original Assignee
Akzo NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akzo NV filed Critical Akzo NV
Publication of JPS6119352A publication Critical patent/JPS6119352A/ja
Publication of JPH0525670B2 publication Critical patent/JPH0525670B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B05D7/16—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies using synthetic lacquers or varnishes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Laminated Bodies (AREA)
JP60142680A 1984-06-30 1985-07-01 可撓性多層ラミネート及びその製法 Granted JPS6119352A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19843424232 DE3424232A1 (de) 1984-06-30 1984-06-30 Flexible polyimid-mehrschicht-laminate
DE3424232.5 1984-06-30
DE3506525.7 1985-02-25

Publications (2)

Publication Number Publication Date
JPS6119352A JPS6119352A (ja) 1986-01-28
JPH0525670B2 true JPH0525670B2 (en]) 1993-04-13

Family

ID=6239591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60142680A Granted JPS6119352A (ja) 1984-06-30 1985-07-01 可撓性多層ラミネート及びその製法

Country Status (2)

Country Link
JP (1) JPS6119352A (en])
DE (1) DE3424232A1 (en])

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0684060B2 (ja) * 1986-05-07 1994-10-26 三菱化成株式会社 硬化ポリイミド樹脂被覆物の製造方法
DE3620601A1 (de) * 1986-06-19 1987-12-23 Akzo Gmbh Verfahren zur herstellung von polyimid-metall-laminaten
JP2621880B2 (ja) * 1987-09-25 1997-06-18 三井東圧化学株式会社 フレキシブル金属プラスチック積層板
JPH01245586A (ja) * 1988-03-28 1989-09-29 Nippon Steel Chem Co Ltd フレキシブルプリント基板
JPH01153875U (en]) * 1988-04-18 1989-10-23
JPH0649185B2 (ja) * 1988-12-29 1994-06-29 新日鐵化学株式会社 フレキシブルプリント配線用基板の製造方法
JPH02180679A (ja) * 1988-12-29 1990-07-13 Nippon Steel Chem Co Ltd フレキシブルプリント配線用基板の製造方法
JPH0693537B2 (ja) * 1989-09-19 1994-11-16 新日鐵化学株式会社 両面導体ポリイミド積層体の製造方法
JPH0443020A (ja) * 1990-06-08 1992-02-13 Yotaro Hatamura 積層基板圧着方法および装置
JP2746555B2 (ja) * 1995-11-13 1998-05-06 新日鐵化学株式会社 フレキシブルプリント基板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1221797B (de) * 1964-07-24 1966-07-28 Westinghouse Electric Corp Verfahren zur Herstellung von Polyimidschichtpressstoffen
US3486934A (en) * 1966-08-01 1969-12-30 Minnesota Mining & Mfg Process for the production of a metal-polyimide composite and the resulting article
US3652355A (en) * 1970-03-12 1972-03-28 Gen Electric Metallic laminated structure and method
DE2063506A1 (de) * 1970-12-23 1972-07-06 Basf Ag Polyimide enthaltende Laminate
US3821054A (en) * 1971-10-19 1974-06-28 E Trostyanskaya Method of chemical bonding of polyimide polymers
FR2198835B1 (en]) * 1972-09-11 1975-03-07 Rhone Poulenc Ind
JPS49129862A (en]) * 1973-04-20 1974-12-12
JPS5572095A (en) * 1978-11-25 1980-05-30 Kanegafuchi Chemical Ind Flexible printed circuit board
JPS56145871U (en]) * 1980-03-31 1981-11-04
JPS5752230A (en) * 1980-09-12 1982-03-27 Hitachi Ltd Driving system of semiconductor
CA1198662A (en) * 1980-09-22 1985-12-31 National Aeronautics And Space Administration Process for preparing high temperature polyimide film laminates
JPS57181857A (en) * 1981-05-06 1982-11-09 Ube Industries Polyimide laminated material and its manufacture
JPS58190092A (ja) * 1982-04-30 1983-11-05 宇部興産株式会社 フレキシブル配線基板の製造法
DE3301197A1 (de) * 1983-01-15 1984-07-19 Akzo Gmbh, 5600 Wuppertal Polyimid-laminate mit hoher schaelfestigkeit

Also Published As

Publication number Publication date
DE3424232A1 (de) 1986-01-23
JPS6119352A (ja) 1986-01-28

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